pie-thermal-engineeringlisted

# Thermal Engineering Skill ## At a Glance Calculate heat transfer rates, size heat exchangers, and analyze data center thermal performance from component-level junction temperatures to facility-wide efficiency metrics. **Activation:** InfrastructureRequest type='thermal', any heat exchanger sizing request, PUE/WUE calculation, airflow management design, or cooling load analysis. **Key capabilities:** - Three-mode heat transfer: conduction (Fourier), convection (Newton), radiation (Stefan-Boltzmann) - Thermal resistance networks (series/parallel, analogous to electrical circuits) - Data center cooling load breakdown (IT, UPS, lighting, fans, envelope) - Heat exchanger sizing via LMTD and epsilon-NTU methods - PUE/TUE/WUE/CUE efficiency metric calculations with target benchmarks - Airflow management: hot/cold aisle containment, raised floor, economizer modes **Integration:** Works in tandem with pie-fluid-systems: the fluid skill sizes cooling loop pipes and pumps; this skill quantifies the heat and determines exchanger performance. > ENGINEERING DISCLAIMER: All calculations must be verified by a licensed Professional Engineer before use in construction or installation. HVAC and mechanical codes (ASHRAE 90.1, IMC) impose requirements not captured here. User assumes all responsibility for verification. **Quick routing:** Heat transfer modes -- see Heat Transfer Fundamentals. Resistance networks -- see Thermal Resistance Networks. Data center loads -- see Data Center Coo