hw-enclosurelisted

# Hardware Enclosure Design Capability Pack > From PCB dimensions to print-ready enclosure — real tool outputs (STL, PDF, diagrams), not sketches. > Scope: IoT / embedded device enclosures. FDM/SLA 3D printing primary, injection molding secondary. > Core deliverable: parametric `.scad` model + STL export + assembly diagrams + dimension drawings. All tolerances, wall thicknesses, and snap-fit parameters derive from manufacturing constraints — never from gut feeling. --- ## Step 0: Pack Prerequisites - **OpenSCAD** (parametric CAD + STL export) — macOS: `brew install --cask openscad` - **D2** (assembly/dimension diagrams), **Typst** (PDF documentation) - Optional: **ADMesh** (STL manifold check), **FreeCAD/CadQuery** (STEP conversion) --- ## Step 1: Context Detection | User Signal | Load Reference | |---|---| | new enclosure, 外壳建模, .scad, OpenSCAD, wall thickness, snap-fit, clamshell, 卡扣, 壳体 | `references/enclosure-design.md` | | PCB mounting, standoff, 安装柱, connector cutout, 开口, USB-C hole, antenna window, 天线, cable routing | `references/pcb-fitting.md` | | which material, PLA/PETG/ABS/ASA, 材料选型, outdoor durability, 耐候, cost per unit, injection molding cost | `references/material-selection.md` | | how to fasten, screws vs snap-fit, 紧固, assembly sequence, 装配顺序, serviceability, 可维修, O-ring, sealing | `references/assembly-design.md` | | handheld, grip, 握持, button placement, 手感, appearance, 外观, color scheme, form factor | `references/ergonomics.md` | | export STL/STEP, slic