hw-circuit-designlisted

# Hardware Circuit Design Capability Pack > From requirements to manufacturing-ready design — schematic, PCB, BOM, power analysis as real artifacts, not paper advice. > Scope: ESP32-family MCUs (C3/S3 primary), low-power IoT devices, battery powered, E-ink/OLED displays. NOT covered: high-frequency RF design (>2.4GHz, antennas excepted) and high-voltage circuits (>48V). > Every parameter comes from a datasheet or supplier page. 编造数据 = FAIL — mark guesses [INFERRED], missing [NOT FOUND], prices [ESTIMATED], compromises [TRADEOFF]. --- ## Step 1: Context Detection | User Signal | Load Reference | |---|---| | pick MCU/display/power IC, 选型, candidate comparison, 替代器件, supply chain risk, 停产, datasheet compare | `references/component-selection.md` | | draw schematic, 原理图, KiCad sheet, net label, decoupling, 去耦, boot pins, reset circuit, ERC errors | `references/schematic-design.md` | | board layout, 布局布线, trace width, 线宽, ground plane, antenna keepout, 天线净空, DRC, Gerber export, 制造文件 | `references/pcb-layout.md` | | BOM, 物料清单, MPN, LCSC/DigiKey part numbers, cost estimate, 成本, dual supplier, 采购清单, MOQ | `references/bom-management.md` | | power architecture, 电源架构, LDO vs DCDC, charging, 充电, power budget, 功耗, battery life, 续航估算 | `references/power-design.md` | | review the design, 设计评审, pre-fab check, ERC/DRC final run, anti-pattern scan, 投产前检查 | `references/design-review.md` | | design spec, 设计文档, decision records, DDR, GPIO table, manufacturing guide, 制造指导, file package | `refer